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Wedge Wire Bonder

Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.

Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages.

The wedge bonding process utilizes ultrasonic energy and pressure to create a bond between the wire and the bond pad. The most predominant process for wedge bonding is a low temperature process or ambient temperature bonding, where aluminum wire is used to make the interconnection of the die and package. This “welding process” (either hot or cold) deforms the wire into a flat elongated shape of a wedge.

Technical specifications

Manufacturer: West·Bond Inc.
Model: 7476E

  • Main Wire: Al, 25um.
  • Bond Force Range: Adjustable, 10 to 250 grams
  • Transducer: Full wave, 110 KHz (nominal)
  • Ultrasonics: Built-in, 8 bit, 3 watts(Ultrasonic Positioning Utility)
  • Wire Range: 0.7 to 2.0 mils, 1x10 mil gold ribbon
  • Protection against Electrostatic Discharge (ESD)


Associated Groups/Units