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Tuesday, 28 September 2021

International Workshop on Advanced Materials-to-Device Solutions for Synaptic Electronics

This event, organized within the framework of the INTERSECT project, will be held in Barcelona, November 10-12. Remote attendance will also be available. Prof. Pablo Ordejón, Director of the ICN2 and Group Leader, is participating as a member of both the Scientific and the Organizing Committee.

From 10 to 12 November 2021, the International Workshop on Advanced Materials-to-Device Solutions for Synaptic Electronics will take place in Barcelona at Casa Convalescència. Organized as part of the activities of the EU-funded project INTERSECT (Interoperable Material-to-Device Simulation Box for Disruptive Electronics), this gathering aims to connect academic research, R&D laboratories and industry around the topic of synaptic electronics and neuromorphic computing, with a specific focus on the role of materials in the design and efficiency of next-generation devices. 

This INTERSECT workshop will bring together experimental and theoretical experts in the field of electrical engineering, physics, chemistry and materials science to discuss the main open problems and possible solutions for the development of volatile and non-volatile memories and memristors. Particular attention will be dedicated to materials-to-device modelling and to innovative interoperable automatic workflows for industry-driven applications, in close connection with the experimental side. Prof. Pablo Ordejón, Director of the ICN2 and leader of the Theory and Simulation Group, is a member of both the Scientific and the Organizing Committee.

The event is free and open to scientific oral and poster contributions (abstract submission open until October 16). It will take place in a hybrid format, to allow people who are not able to travel to Barcelona to attend the meeting in a virtual fashion. You can register to the conference here.

 

  

The H2020 INTERSECT project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 814487.