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Tuesday, 05 February 2019

The INTERSECT Project will accelerate the deployment process of innovative materials and devices

by Àlex Argemí

The H2020 European Project Interoperable Material-to-Device simulation box for disruptive electronics (INTERSECT) will drive the uptake of materials modelling software in industry, bridging the gap between academic innovation and industrial novel production. Prof. Pablo Ordejón, Director of the ICN2 and Group Leader of the ICN2 Theory and Simulation Group, is one of the project partners attending the kick-off meeting held in Modena on 4-5 February.

The current worldwide drive for big data, machine learning, and quantum computing provides a unique opportunity for European industry to play a leading role by deploying novel technologies based on innovative materials and devices. It will require fast exploration of materials’ properties, linking properties to performance in unexplored architectures, and assessing their business potential. The H2020 European Project Interoperable Material-to-Device simulation box for disruptive electronics (INTERSECT) is willing to tackle this challenge after its kick-off meeting, celebrated on 4-5 February in Modena (Italy).

INTERSECT will drive the uptake of materials modelling software in industry, bridging the gap between academic innovation and industrial novel production. Its goal is to accelerate by one order of magnitude the process of materials’ selection and device design and deployment. To do so, the project partners will produce an interoperable material-to-device simulation platform integrating some of the most used open-source materials modelling codes (including SIESTA) with models and modelling software for emerging devices.

Prof. Pablo Ordejón, ICN2 Director and Group Leader of the ICN2 Theory and Simulation Group, is among the project partners. He is one of the co-creators of the SIESTA package, selected by the Journal of Physics as one of the most important breakthroughs published in its pages.