Nanofabrication facility - Equipment - Packaging
Packaging
Packaging is often the final step in making a nanofabrication device functional as a stand-alone device or in the context of an integrated system. The devices may need to be electrically connected to an interface via a process of gold or aluminium wire bonding. ICN2 Nanofabrication facility houses a wedge-wedge wire bonder.
|
Technique |
Instrument |
Defining feature |
|---|---|---|
|
West-bond 7476E |
Aluminum and gold bonding |