Precision Polishing System - Allied Multiprep (TM)
The MultiPrepTM is a precision polishing system that enables precise semiautomatic sample polishing of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process.
Digital indicators enable quantifiable material removal, which can be monitored real-time, or preset for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.
Applications
- Sample preparation equipment
Contact
Electron Microscopy Unit
electron.microscopy@icn2.cat-
Francisco Javier Belarre Triviño
Research technician of the electron microscopy sample preparation Lab.
francisco.belarre(ELIMINAR)@icn2.cat
Tel. +34937371630
Associated Groups/Units
