Thermo Fisher Scientific Helios 5 UX FIB

The FIB Helios 5 UX is a high-performance focused ion beam (FIB) scanning electron microscope (SEM) system designed and manufactured by the company Thermo Fisher. This advanced equipment is used for a wide range of applications, including materials science, nanotechnology, and semiconductor analysis.

The FIB Helios 5 UX is equipped with a high-resolution SEM (Elstar extreme high-resolution field emission) that provides images with a resolution of up to 0.8 nm, allowing researchers to see details at the nanoscale. Additionally, the system includes an ion column (Phoenix Ion Column with superior high-current and low-voltage performance) that can be used to modify, manipulate and prepare samples, making it an ideal tool for creating high quality TEM lamellas at low voltage.

Technical specifications

• Ion optics:
  • Ion beam current range: 1 pA – 65 nA
  • Accelerating voltage range: 500 V – 30 kV
  • Max. horizontal field width: 0.7 mm at beam coincidence point
• Electron optics:
  • Electron beam resolution:
    • At optimum working distance (WD):
      • 0.6 nm at 30 kV STEM
      • 0.7 nm at 1 kV
      • 1.0 nm at 500 V (ICD)
    • At coincident point:
      • 0.6 nm at 15 kV
      • 1.2 nm at 1 kV
  • Electron beam current range: 0.8 pA to 100 nA
  • Accelerating voltage range: 350 V – 30 kV
  • Landing energy range: 20 eV – 30 keV
  • Maximum horizontal field width: 2.3 mm at 4 mm WD
• Detectors:
  • In-lens SE/BSE detector (TLD-SE, TLD-BSE)
  • In-column SE/BSE detector (ICD)
  • In-column BSE detector (MD)
  • Everhart-Thornley SE detector (ETD)
  • High-performance in-chamber electron and ion detector (ICE) for secondary ions (SI) and electrons (SE)
  • Retractable STEM 3+ detector with BF/ DF/ HAADF segments
  • Integrated beam current measurement
• CryoMAT Loader:
  

  Quick Loader with a Cryo option. This cryo transfer system can help stabilize non-wet materials (typically materials with < 2% water), operating temperature range +100C to -190C. Temperature is microprocessor controlled and the stability is better than +/- 1 °C. T

Applications

• Ultra high-quality, site-specific, ultra-thin sample preparation for TEM (In-situ, Ex-situ, X-Sectional) and APT, free of artifacts or amorphous layers.
• Ion milling conformation and deposition (W, C) of complex structures with critical dimensions of less than 10 nm.
• Cryogenic sample conditions (optional) that allows the preparation of non-wet materials as beam sensitive materials (polimers, low K dielectrics, hard and soft materials, dehydrated biological samples, etc.) with simultaneously direct SEM characterization.
• SEM characterization at the subnanometer scale (< 1 nm)
• STEM mode (BF/ DF/ HAADF) for studying the internal structure of the materials.